It’s time to think beyond the hype of Internet of Things, to look beyond the technology and find actual business value, particularly around consumer engagement. In this discussion, we’ll explore how and when companies can and should or should not use data and personalization capabilities to create connected brand experiences. We’ll also identify and define the primary use cases for consumer-facing IoT (e.g. reward, decision-making, innovation, and more) for how brands can leverage emerging technological capabilities to enhance customer interaction and experience.
In her presentation, you will learn:
• How to contextualize IoT into consumer-facing business functions and programs
• Five primary use cases for consumer-facing IoT and examples of each
• Four steps to take to prepare your organization for IoT-enabled customer experiences
• Steps to prepare your organization for IoT enabled customer experiences Source
Internet of Things PCB things to consider for Startups
Since IoT products are so latest, you would assume that getting an IoT printed circuit board (PCB) project off the ground starts by reinventing the wheel and enduring a number of technical problem. That is most certainly far from the truth.
Nevertheless it doesn’t indicate IoT startups have a apparent path to fame. Facing them is a number of design and manufacturing concerns that are special to these small products. These factors to consider should be looked at for the fresh new IoT device to reach their goals.
On the plus side, it’s essential for IoT startups to learn that the basic foundation for a successful cool product does exist. This simply means experience and knowledge involving the design, fabrication and assembly of these superior products are available. Also, the most sage advice is for judicious IoT product businessmen and creators to take the recommendation that skilled electronics manufacturing services or EMS providers offer. These companies in addition to their engineering employees have practiced the task with pioneering IoT corporations in Silicon Valley moving into the early stages of this promising field.
The PCB of an IoT product is a different beast than the traditional one, which is much larger and flat. IoT devices, conversely, consist mainly of either rigid-flex or flex circuit assemblies, which come with their very own sets of design layout, fabrication and assembly factors to consider and technicalities.
A foremost consideration is to search for expert designers who’ve performed a large amount of rigid-flex PCB designs. PCB space for an IoT product is at a premium. So you want the designer to have direct layout knowledge to properly design vital elements on that small area.
Additionally, the majority of IoT units aren’t stationary; they receive substantial movement and folding. Right here, the expert designer plays a key role in working out bend ratios and lifecycle iterations as a critical part of a design. Various other vital design layout factors to consider comprise of signal trace thickness, number of rigid and flex circuit layers, copper weight and stiffener placement. Stiffeners are used on flex circuits in order to guarantee elements placed on the flex circuit keep on being closely in position to prevent movement.
An additional focus is through-hole component positioning in rigid-flex circuits. Why is that significant? A great deal of IoT products are founded on surface mount device(SMD) placement. Yet , there might be through-hole elements, which are commonly put on either the rigid portion or the flex area of the board. Through-hole elements are usually employed to connect input/output or I/O signals to the outer world. Like that, those signals can be viewable using an LCD or LED monitor. Through-hole component placement is a key account in an IoT system due to the fact when used on the flex portion of the board, appropriate stiffeners have to be designed and implemented for good assembly.
And finally in the layout category, the heat which elements generate has to be thought about. IoT units are more and more difficult with rigid-flex and flex circuits featuring in excess of 12 – 14 layers. A few units are digital. Yet , ever more analog systems are being exercised in IoT systems. Analog circuitry brings about a great deal more heat than digital ones. This indicates heat expansion and then contraction rate has to be thought of. In tech lingo, this is termed as the Coefficient of Thermal Expansion or CTE and the right treatments for it.
Choosing the proper fabricator is very important and is linked to the EMS company you have picked. The fabricator you’re looking for require IoT PCB fabrication practical experience. Among vital factors to consider here are assuring durable adhesions between layers on both rigid and flex circuit sides, figuring out all the crucial calculations and having a thorough knowledge of when current moves from the rigid side to the flex side.
Such fabricators must also have an in-depth comprehension of remarkably compact components similar to 0201 and 00105 device packages, package-on-package, and the use of fine-pitch ball-grid array or BGA packaged devices.
Additionally they ought to have experience of designing boards with fairly tight tolerances in terms of footprint for those types of BGA devices, in terms of up-to-date capabilities like laser direct imaging for putting the solder mask on the board. They must have laser drills for via drilling with sizes of 5 mils or under as these IoT units could be so small that a standard drill size of 5 to 8 mils perhaps might not suffice. They might need to go to a 3 mil, meaning that you should get an leading-edge laser drilling capability on-site.
In cases where you’re placing via-in-pad, it’s a easy way to utilize the small real estate which is available on the rigid-flex board, but it presents difficulties for assembly. If vias are not fully planar or flat in shape, it will be an issue all through the assembly of those tiny BGA packaged devices. This is because non-planar surfaces may put in danger the integrity of solder joints.
Sometimes via in pads leave bumps in the event that they’re not scoured the proper way after positioning the vias and gold finish on the top. In cases where there are bumps, then the solder joints in the assembly for those tiny BGA balls in those IoT devices might not be a great joint. It could create spotty connections, which might be a larger issue to address and take care of. It all boils down to which EMS company you are using because they’re the ones who will find the fabrication plant to make a profitable IoT product for you.
It’s very important to pay a visit to expert EMS companies that have proficiently assembled IoT and wearable PCBs since they have special tooling and fixtures already available, which are vital for assembly to be certain that components are placed appropriately, precisely and the printing is accomplished appropriately.
Printing might be a headache for IoT systems. If it’s a rigid-flex board, then there exists a difference between thicknesses of the rigid and flex circuit portions, which suggests a special fixture is needed to keep the complete rigid-flex board planar or utterly flat to allow effective printing to be realized.
Startups must be ready to discover the appropriate manufacturing partners and EMS firms. In this way they can make sure they have got sufficient experience ahead of time to get the multitude of design, fabrication and assembly details successfully performed because they are key to a successful and prompt IoT product launch.